Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containning polymer of silicon, oxygen, and hydrogen

ABSTRACT

An SOG film  16  obtained by heat-treating a polysilazan type SOG film at high temperature of about 800° C. is used as a planarized insulating film to be formed on the gate electrode  9  of a MISFET (Qs, Qn, Qp) A polysilazan SOG film  57  not subjected to such a heat treatment is used as interlayer insulating film arranged among upper wiring layers ( 54, 55, 56, 63 ).

[0001] This application is a Divisional application of application Ser.No. 09/664,381, filed Sep. 18, 2000, which is a Divisional applicationof application Ser. No. 09/536,751, filed Mar. 28, 2000.

TECHNICAL FIELD OF THE INVENTION

[0002] This invention relates to a semiconductor integrated circuitdevice and also to a method of manufacturing thereof. More particularly,the present invention relates to an insulating film structure forforming a MISFET (Metal Insulator Semiconductor Field Effect Transistor)having micro-dimensions and also to a technique that can effectively beused for a process of forming such a structure.

BACKGROUND OF THE INVENTION

[0003] Conventionally, the process of planarizing an insulating filmformed on the gate electrode of a MISFET is carried out by means of amethod of reflowing the deposited BPSG (Baron-doped Phospho SilicateGlass) film on the gate electrode at high temperature between about 850and 900° C. However, in the current trend of down-sizing MISFETs tomicro-dimensions, while the space between the gate electrodes of twoadjacently located devices becoming small, it is highly difficult to usea BPSG film as insulating film to be planarized on the gate electrode.

[0004] A so-called self align contact technique (see, inter alia,Japanese Patent Application Laid-Open No. 9-252098) is typically usedfor the process of connecting wires to the source/drain of a MISFEThaving micro-dimensions by way of a contact hole. It is a technique offorming a silicon nitride film on the upper and lateral surfaces of thegate electrode in order to produce a contact hole by utilizing thedifference between the rate of etching the silicon nitride film and thatof etching the insulating film that is typically made of silicon oxideand deposited on the silicon nitride film so that no margin has to betaken into consideration for the alignment of the contact hole and thegate electrode.

[0005] However, when a silicon nitride film is formed on the upper andlateral surfaces of the gate electrode of a very fine MISFET, the spacebetween the gate electrodes of two adjacently located devices can becomeextremely small. Then, voids can appear in the BPSG film buried in thespace. Additionally, in the case of a device to be manufactured on adesign rule adapted to dimensions of 0.25 μm or less, the performance ofthe manufactured MISFET can become degraded when a BPSG film thatrequires a heat treatment involving temperature above 800° C. is appliedthereto after forming the MISFET.

[0006] A Spin On Glass (SOG) film that can be obtained by applying achemical solution of a silicon compound dissolved in an organic solventand baking it at temperature between about 400 and 450° C. to gasify anddispel the solvent is expected to be used as a planarized insulatingfilm to be formed on the gate electrode of a MIS device with dimensionsof 0.25 μm or less requiring low process temperature because it shows anexcellent gap filling effect for the space between the gate electrodesof two adjacently located devices and not costly.

[0007] Additionally, an SOG film formed by using hydrosilsesquioxan asraw material shows a low dielectric constant if compared with a siliconoxide film formed by means of CVD and hence is expected to provide aneffect of reducing the wiring delay when used as interlayer insulatinglayer of a multilayer metal wiring system.

[0008] On the other hand, SOG film has drawbacks including (I) that itcan give rise to corrosion to metal wires because it is less resistantto moisture than a CVD-silicon oxide film and (ii) that it is soft andhence can hardly withstand chemical mechanical polishing (CMP) so that,when planarizing a global region including densely wired area andscarcely wired areas, the CMP process has to be conducted afterdepositing a silicon oxide film on the SOG film. A variety of techniqueshave been proposed to bypass the drawbacks.

[0009] For instance, Japanese Patent Application Laid-Open No. 3-330982discloses a technique of reducing the hygroscopicity of SOG film bybaking the SOG film at temperature between 400 and 750° C., subjectingit, if necessary, to an oxygen plasma processing operation (or an argoninjecting operation), forming thereon an anti-moisture film (e.g.,CVD-oxide film) and then thermally treating it at temperature between550 and 750° C.

[0010] Japanese Patent Application Laid-Open No. 8-78528 discloses atechnique of preventing the aluminum (Al) wires of a device from beingcorroded by the gas (containing moisture) produced by the SOG film as aresult of degasification by forming a through hole through theinsulating film (CVD-oxide film/SOG film/CVD-oxide film) on the aluminumwire, discharging the gas by thermally treating the device attemperature between 300 and 350° C. and subsequently forming a side wallspacer of silicon oxide film along the lateral wall of the through hole.

[0011] Japanese Patent Application Laid-Open No. 9-283515 describes atechnique of suppressing micro-projections that can appear on thesurface of a ceramic-like silicon oxide film when an SOG film isheat-treated in an inert gas atmosphere, the technique comprising stepsof spin-coating a solution of hydrosilsesquioxan (HSQ) onto a substrate,conducting a first heat treatment process at temperature lower than 400°C. to turn it into a pre-ceramic film and subsequently conducting asecond heat treatment process at temperature lower than 400° C. in anoxidizing gas atmosphere (oxygen+nitrogen) to produce a ceramic-likesilicon oxide film.

[0012] Japanese Patent Application Laid-Open No. 8-125021 describes atechnique of perfectly hardening an SOG film comprising steps ofquasi-hardening the SOG film in a preliminary heat treatment processconducted at temperature between 70 and 220° C., modifying a surfacelayer of the SOG film by treating it with ozone/ultraviolet rays andsubsequently heat-treating it in a process conducted in an oxygen ornitrogen atmosphere and including a pre-heat-treatment at 400 to 500° C.and a post-heat-treatment at 700 to 1,000° C.

[0013] Finally, Japanese Patent Application Laid-Open No. 10-107026describes a technique of improving the ant-crack performance of an SOGfilm made of hydrosilsesquioxan (HSQ) and raising the density thereof bycuring it with electron beams at temperature between room temperatureand 500° C.

SUMMARY OF THE INVENTION

[0014] The inventors of the present invention have looked into thefeasibility of using polysilazan type SOG film and hydrosilsesquioxantype SOG film for the planarized insulating film to be formed on thegate electrode of a MISFET.

[0015] Polysilazan is characterized by having a molecular structurewhere nitrogen (N) atoms and hydrogen (H) atoms are bonded to eachsilicon (Si) atom. For forming SOG film, using polysilazan as rawmaterial, firstly a chemical solution prepared by dissolving polysilazaninto a solvent is applied onto a substrate by spin coating and then theapplied solution is baked to gasify and dispel the solvent.Subsequently, the SOG film is subjected to a steam-oxidation process athigh temperature to make the hydrogen atoms bonded to the silicon atomsand the NH-radicals react with each other in a manner as expressed bychemical formula (1) for each molecule. Then, the produced hydrogen gasand ammonium gas are made to leave the film to produce a dense andhighly moisture-resistant SOG film having Si—O—Si bonds.

[0016] However, the inventors of the present invention have found thatthe obtained SOG film contains a trace of residual nitrogen originatingfrom polysilazan. Therefore, when an SOG film is formed on the gateelectrode with a silicon nitride film interposed therebetween, it is nolonger possible to secure a satisfactory level of etch selectivitynecessary for forming a contact hole by utilizing the difference betweenthe rate of etching the silicon nitride film and that of etching the SOGfilm particularly if the contact hole is required to have a smalldiameter.

[0017] On the other hand, hydrosilsesquioxan has a molecular structurewhere oxygen (O) atoms and hydrogen (H) atoms are bonded to each silicon(Si) atom and hence does not contain any nitrogen in the molecule. Forforming SOG film, using hydrosilsesquioxan as raw material, a chemicalsolution prepared by dissolving hydrosilsesquioxan into a solvent isapplied onto a substrate by spin coating and then the applied solutionis heat-treated to gasify and dispel the solvent. As a result, achemical reaction as expressed by formula (2) below takes place tooxidize the Si—H bonds by 20 to 30% and produce an SOG film having Si—OHbonds.

[0018] However, since the hydrosilsesquioxan type SOG film has Si—Hbonds in each molecule, it gives rise to a problem of producingdischarging gas on hydrogen if a heat treatment is conducted at farhigher temperature than 400° C. in the process after forming the film.

[0019] For example, hydrogen gas and other gases are produced during theprocess of forming a through hole through the preparedhydrosilsesquioxan type SOG film and burying a conductor layer in thethrough hole if the temperature of forming the conductor layer exceeds400° C. Then, the operation of burying the conductor layer proceedsinsufficiently to consequently raise the resistance of layer.Additionally, since the etching condition can become modified by thegenerated hydrogen gas, it is highly difficult to produce a throughshowing a high aspect ratio.

[0020] In view of the above identified circumstances, it is therefore anobject of the present invention to provide a technique of forming aninsulating film that can encourage the efforts for down-sizing MISFETs.

[0021] Other objects and novel features of the present invention willbecome apparent in the following description of the invention made byreferring to the accompanying drawings that illustrate preferredembodiments of the invention.

[0022] Firstly, the present invention will be summarily described.

[0023] (1) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a MISFET formed onsaid principal surface of said semiconductor substrate; a first wiringlayer formed on said MISFET with a first insulating film interposedtherebetween; and a second wiring layer formed on said first wiringlayer with a second insulating film interposed therebetween;

[0024] each of said first insulating film and said second insulatingfilm including an insulating film formed by applying a liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient, the relative dielectric constant of said second insulatingfilm being lower than that of said first insulating film.

[0025] (2) A semiconductor integrated circuit device as set forth in (1)above, wherein said polymer is hydrosilsesquioxan.

[0026] (3) A semiconductor integrated circuit device as set forth in (1)above, wherein the hydrogen content of said second insulating film ishigher than that of said first insulating film.

[0027] (4) A semiconductor integrated circuit device as set forth in (1)above, wherein the surface of said first insulating film is planarizedby polishing.

[0028] (5) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface, a MISFET formed onsaid principal surface of said semiconductor substrate; a firstinsulating film formed on said MISFET; a capacitive element formed onsaid first insulating film with a first electrode, a second electrodeand a dielectric film interposed between said first and secondelectrodes; and a second insulating film formed on said capacitiveelement;

[0029] each of said first insulating film and said second insulatingfilm including an insulating film formed by applying a liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient; and hydrogen content of said second insulating film beinglower than that of said first insulating film.

[0030] (6) A semiconductor integrated circuit device as set forth in (5)above, wherein the relative dielectric constant of said secondinsulating film is higher than that of said first insulating film.

[0031] (7) A semiconductor integrated circuit device as set forth in (5)above, further comprising a first metal wire and a second metal wireformed on said capacitive element, said second insulating film beinginterposed between said first metal wire and said second metal wire.

[0032] (8) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a semiconductorregion formed on said principal surface of said semiconductor substrate;a silicon nitride film formed on said semiconductor region; a firstinsulating film formed on said silicon nitride film and showing anetching rate different from said silicon nitride film; a first contacthole formed through said first insulating film and said silicon nitridefilm; a first conductor film formed in said first contact hole andelectrically connected to said semiconductor region; and a secondconductor film formed on said first insulating film with a secondinsulating film interposed therebetween;

[0033] said first insulating film including an insulating film formed byapplying a liquid substance containing a polymer of silicon, oxygen andhydrogen as principal ingredient; and said second insulating filmincluding an insulating film formed by applying a liquid substancecontaining a polymer of silicon, nitrogen and hydrogen as principalingredient.

[0034] (9) A semiconductor integrated circuit device as set forth in (8)above, wherein said polymer of silicon, oxygen and hydrogen ishydrosilsesquioxan and said polymer of silicon, nitrogen and hydrogen issilazan.

[0035] (10) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a semiconductorregion formed on said principal surface of said semiconductor substrate;a silicon nitride film formed on said semiconductor region; a firstinsulating film formed on said silicon nitride film and showing anetching rate different from said silicon nitride film; a first contacthole formed through said first insulating film and said silicon nitridefilm; and a first conductor film formed in said first contact hole andelectrically connected to said semiconductor region;

[0036] said first insulating film being formed by applying a liquidsubstance containing a polymer of silicon, oxygen and hydrogen asprincipal ingredient.

[0037] (11) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a MISFET formed onsaid principal surface of said semiconductor substrate; a siliconnitride film formed on said MISFET; a first insulating film formed onsaid silicon nitride film and showing an n etching rate different fromsaid silicon nitride film; a first contact hole formed through saidfirst insulating film and said silicon nitride film; a first conductorfilm formed in said first contact hole and electrically connected toeither of said source/drain of said MISFET; a capacitive element formedon said first insulating film and electrically connected to either ofsaid source/drain by way of said first conductor film; and a first metalwire formed on said capacitive element with a second insulating filminterposed therebetween;

[0038] each of said first insulating and said second insulating filmincluding an insulating film formed by applying a liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient; and the relative dielectric constant of said secondinsulating film being lower than that of said first insulating film.

[0039] (12) A semiconductor integrated circuit device as set forth in(11), wherein the surface of said first insulating is planarized bypolishing.

[0040] (13) A semiconductor integrated circuit device as set forth in(11), wherein said capacitive element comprises a capacitive insulatingfilm, which includes a film containing high dielectrics orferroelectrics having a perovskite crystal structure or a complexperovskite crystal structure as principal ingredient.

[0041] (14) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a MISFET formed onsaid principal surface of said semiconductor substrate; a siliconnitride film formed on said MISFET; a first insulating film formed onsaid silicon nitride film and showing an n etching rate different fromsaid silicon nitride film; a first contact hole formed through saidfirst insulating film and said silicon nitride film; a first conductorfilm formed in said first contact hole and electrically connected toeither of said source/drain of said MISFET; a capacitive element formedon said first insulating film and electrically connected to either ofsaid source/drain by way of said first conductor film; and a first metalwire formed on said capacitive element with a second insulating filminterposed therebetween;

[0042] said first insulating film including an insulating film formed byapplying a liquid substance containing a polymer of silicon, oxygen andhydrogen as principal ingredient, said second insulating film includingan insulating film formed by applying a liquid substance containing apolymer of silicon, nitrogen and hydrogen as principal ingredient, therelative dielectric constant of said second insulating film being lowerthan that of said first insulating film.

[0043] (15) A semiconductor integrated circuit device comprising: asemiconductor substrate having a principal surface; a MISFET formed onsaid principal surface of said semiconductor substrate; a bit lineformed on said MISFET with a first insulating layer interposedtherebetween; a capacitive element formed on said bit line with a secondinsulating film interposed therebetween; and a first metal wire formedon said capacitive element with a third insulating film interposedtherebetween;

[0044] said bit line being connected to either of said source/drain ofsaid MISFET by way of a first contact hole formed through said firstinsulating film, said capacitive element being connected to the other ofsaid source/drain by way of a second contact hole formed through saidsecond insulating film and of a third contact hole formed through saidfirst insulating film, each of said first insulating film, said secondinsulating film and said third insulating film including an insulatingfilm formed by applying a liquid substance containing a polymer ofsilicon, oxygen and hydrogen as principal ingredient, the relativedielectric constant of said third insulating film being lower than thatof said first insulating film and that of said second insulating film.

[0045] (16) A semiconductor integrated circuit device as set forth in(15), further comprising a second metal wire formed on said first metalwire with a fourth insulating film interposed therebetween, said fourthinsulating film including an insulating film formed by applying a liquidsubstance containing a polymer of silicon, oxygen and hydrogen asprincipal ingredient, the relative dielectric constant of said fourthinsulating being lower than that of said first insulating film and thatof said second insulating film.

[0046] (17) A semiconductor integrated circuit device as set forth in(15), wherein said first insulating film comprises a silicon nitridefilm covering the top and lateral surfaces of the gate electrode of saidMISFET and said insulating film formed on said silicon nitride film, andthe surface of said first insulating film is planarized by polishing.

[0047] (18) A method of manufacturing a semiconductor integrated circuitdevice comprising the steps of:

[0048] (a) forming a silicon nitride film on the principal surface of asemiconductor substrate and subsequently applying a liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient onto said silicon nitride film;

[0049] (b) forming an insulating film by subjecting said liquidsubstance to a first heat treatment, thereby gasifying the solventthereof; and

[0050] (c) forming a contact hole through said insulating and saidsilicon nitride film by etching said insulating with a high etching raterelative to said silicon nitride film and subsequently etching saidsilicon nitride film.

[0051] (19) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (18), wherein said polymer is hydrosilsesquioxan.

[0052] (20) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (18), wherein, after having been subjected tosaid first heat treatment, said insulating film is subjected to a secondheat treatment at temperature higher than said first heat treatmentprior to said step of etching said insulating film.

[0053] (21) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0054] (a) forming a semiconductor region on the surface of asemiconductor substrate and subsequently applying a liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient onto said semiconductor region;

[0055] (b) forming an insulating film by subjecting said liquidsubstance to a first heat treatment, thereby gasifying the solventthereof;

[0056] (c) subjecting said insulating film to a second heat treatmentand subsequently forming a contact hole by drying etching saidinsulating film; and

[0057] (d) forming a conductor layer electrically connected to saidsemiconductor region in said contact hole.

[0058] (22) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (21), wherein the temperature of said second heattreatment is higher than that of said first heat treatment.

[0059] (23) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0060] (a) forming a first insulating film by applying a liquidsubstance containing a polymer of silicon, oxygen and hydrogen asprincipal ingredient onto the principal surface of a semiconductorsubstrate and subsequently subjecting said liquid substance to a firstheat treatment, thereby gasifying the solvent thereof;

[0061] (b) subjecting said first insulating film to a second heattreatment in an oxygen-containing atmosphere and subsequently chemicallyand mechanically polishing the surface of said first insulating film;

[0062] (c) forming a conductor member by forming a conductor film onsaid first insulating film and subsequently by etching said conductorfilm; and

[0063] (d) forming a second insulating film on said conductor member.

[0064] (24) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (23), wherein the relative dielectric constant ofsaid second insulating film is lower than that of said first insulatingfilm.

[0065] (25) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (23), wherein the hydrogen content of said secondinsulating film is higher than that of said first insulating film.

[0066] (26) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (23), wherein said second insulating film isformed by applying a liquid substance containing a polymer of silicon,oxygen and hydrogen as principal ingredient onto said conductor memberand subsequently by subjecting said liquid substance to a first heattreatment, thereby gasifying the solvent thereof.

[0067] (27) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0068] (a) forming a plurality of first conductor members on theprincipal surface of a semiconductor substrate and subsequently applyinga liquid substance containing a polymer of silicon, oxygen and hydrogenas principal ingredient into a space between said first conductormembers and also onto said first conductor members;

[0069] (b) forming an insulating film by subjecting said liquidsubstance to a first heat treatment, thereby gasifying the solventthereof, and subsequently subjecting it to a second heat treatment in anoxygen-containing atmosphere;

[0070] (c) forming a capacitive element including a first electrode, acapacitive insulating film and a second electrode on said insulatingfilm.

[0071] (28) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (27), wherein the temperature of said second heattreatment is higher than that of said first heat treatment.

[0072] (29) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (27), wherein the temperature of said second heattreatment is higher than the temperature for forming said capacitiveinsulating film of said capacitive element.

[0073] (30) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (27), wherein said capacitive insulating film ofsaid capacitive element includes a film containing high dielectrics orferroelectrics having a perovskite crystal structure or a complexperovskite crystal structure as principal ingredient.

[0074] (31) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0075] (a) forming a plurality of first conductor members on theprincipal surface of a semiconductor substrate and subsequently applyinga first liquid substance containing a polymer of silicon, oxygen andhydrogen as principal ingredient into a space between said firstconductor members and also onto said first conductor members;

[0076] (b) forming a first insulating film by subjecting said liquidsubstance to a first heat treatment, thereby gasifying the solventthereof, and subsequently subjecting it to a second heat treatment in anoxygen-containing atmosphere;

[0077] (c) forming a capacitive element including a first electrode, acapacitive insulating film and a second electrode on said firstinsulating film and subsequently applying a second liquid substancecontaining a polymer of silicon, oxygen and hydrogen as principalingredient onto said capacitive element;

[0078] (d) forming a second insulating film by subjecting said secondliquid substance to a third heat treatment, thereby gasifying thesolvent thereof.

[0079] (32) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (31), wherein said polymer is hydrosilsesquioxan.

[0080] (33) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (31), wherein the temperature of said second heattreatment is higher than that of said first heat treatment and that ofsaid third heat treatment.

[0081] (34) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (31), wherein the temperature of said second heattreatment is higher than the temperature for forming said capacitiveinsulating film of said capacitive element.

[0082] (35) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (31), wherein the relative dielectric constant ofsaid second insulating film is lower than that of said first insulatingfilm.

[0083] (36) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (31), wherein said step of forming saidcapacitive element on said first insulating film includes a step offorming a third insulating film on said first insulating film by CVD, astep of forming a groove in said third insulating film and a step offorming said capacitive element in said groove.

[0084] (37) A method of manufacturing a semiconductor integrated circuitdevice comprising a step of forming a MISFET on the principal surface ofa semiconductor substrate and subsequently forming a first insulatingfilm on said MISFET and a step of forming a capacitive element includinga first electrode, a capacitive insulating film and a second electrodeon said first insulating film and subsequently forming a secondinsulating film on said capacitive element; each of said firstinsulating and said second insulating film including an insulating filmformed by applying a liquid substance containing a polymer of silicon,oxygen and hydrogen as principal ingredient; and the relative dielectricconstant of said second insulating film being lower than that of saidfirst insulating film.

[0085] (38) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (37), wherein the surface of said firstinsulating film is planarized by chemical and mechanical polishing.

[0086] (39) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (37), wherein the hydrogen content of said secondinsulating film is higher than that of said first insulating film.

[0087] (40) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (37), further comprising a step of forming afirst metal wire on said second insulating film and forming a secondmetal wire on said first metal wire with a third insulating filminterposed therebetween, said third insulating film including aninsulating film formed by applying a liquid substance containing apolymer of silicon, oxygen and hydrogen as principal ingredient, therelative dielectric constant of said third insulating film being lowerthan that of said first insulating film.

[0088] (41) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0089] (a) forming a MISFET on the principal surface of a semiconductorsubstrate and subsequently applying a first liquid substance containinga polymer of silicon, oxygen and hydrogen as principal ingredient;

[0090] (b) forming a first insulating film by subjecting said firstliquid substance to a first heat treatment and subsequently subjectingsaid first insulating film to a second heat treatment to be conducted attemperature higher than said first heat treatment in anoxygen-containing atmosphere;

[0091] (c) forming a metal wire containing aluminum (Al) as principalingredient on said first insulating film and subsequently applying asecond liquid substance containing a polymer of silicon, oxygen andhydrogen as principal ingredient onto said metal wire; and

[0092] (d) forming a second insulating film by subjecting said secondliquid substance to a third heat treatment to be conducted attemperature lower than said second heat treatment.

[0093] (42) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (41), wherein the relative dielectric constant ofsaid second insulating film is lower than that of said first insulatingfilm.

[0094] (43) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (41), wherein the temperature of said third heattreatment is lower than that of degrading said metal wire.

[0095] (44) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (41), further comprising a step of planarizingthe surface of said first insulating film by chemical and mechanicalpolishing to be conducted after said step (b).

[0096] (45) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (41), further comprising:

[0097] (e) a step of irradiating ultraviolet rays to the surface of saidsecond insulating film in an oxygen-containing atmosphere to beconducted after said step (d);

[0098] (f) a step of applying a third liquid substance containing apolymer of silicon, oxygen and hydrogen as principal ingredient to thesurface of said second insulating film irradiated with ultraviolet rays;and

[0099] (g) a step of raising the height of said second insulating filmby subjecting said third liquid substance to a fourth heat treatment.

[0100] (46) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0101] (a) forming a MISFET on the principal surface of a semiconductorsubstrate and subsequently applying a first liquid substance containinga polymer of silicon, oxygen and hydrogen as principal ingredient ontosaid MISFET;

[0102] (b) forming a first insulating film by subjecting said firstliquid substance to a first heat treatment and subsequently subjectingsaid first insulating film to a second heat treatment to be conducted attemperature higher than said first heat treatment in anoxygen-containing atmosphere;

[0103] (c) forming a capacitive element on said first insulating filmand subsequently applying a second liquid substance containing a polymerof silicon, oxygen and hydrogen as principal ingredient onto saidcapacitive element; and

[0104] (d) forming a second insulating film by subjecting said secondliquid substance to a third heat treatment to be conducted attemperature lower than said second heat treatment.

[0105] (47) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (46), wherein the temperature of said third heattreatment is lower than that of degrading said capacitive insulatingfilm of said capacitive element.

[0106] (48) A method of manufacturing a semiconductor integrated circuitdevice comprising steps of:

[0107] (a) forming a groove on the element isolating region of theprincipal surface of a semiconductor substrate and subsequently applyingliquid substance containing a polymer of silicon, oxygen and hydrogen asprincipal ingredient onto said semiconductor substrate including theinside portion of said groove;

[0108] (b) forming an insulating film by subjecting said liquidsubstance to a first heat treatment and subsequently subjecting saidinsulating film to a second heat treatment to be conducted attemperature higher than said first heat treatment in anoxygen-containing atmosphere; and

[0109] (c) forming an element isolating groove on the principal surfaceof said semiconductor substrate by chemically and mechanically polishingsaid insulating film subjected to said second heat treatment, leavingsaid insulating film in the inside portion of said groove.

[0110] (49) A method of manufacturing a semiconductor integrated circuitdevice as set forth in (48), wherein said polymer is hydrosilsesquioxan.

[0111] According to the invention, it is now possible to realize a selfalign contact with ease because an insulating film showing a highetching rate relative to a silicon nitride film can be prepared byforming said insulating film on a MISFET, using a polymer not containingnitrogen as raw material.

[0112] According to the invention, it is now possible to use a CMPtechnique to an insulating film formed by applying a polymer substancebecause the density of the formed film can be raised by subjecting it toa heat treatment at high temperature.

[0113] According to the invention, the inter-wire parasitic capacitancecan be reduced by using an insulating film showing a low dielectricconstant for the interlayer insulating film to be arranged betweenwires.

[0114] According to the invention, it is now possible to reduce the costof manufacturing a semiconductor integrated circuit device by using aninsulating film formed by applying a polymer substance that is lessexpensive than an insulating film formed by CVD.

[0115] According to the invention, it is now possible to obtain aninsulating film practically not containing hydrogen by subjecting a filmformed by applying a polymer substance to a heat treatment at hightemperature. Therefore, it is possible to effectively prevent theinsulating film from discharging gas.

BRIEF DESCRIPTIONS OF THE DRAWINGS

[0116]FIG. 1 is a schematic cross sectional view of a principal portionof a substrate, illustrating the embodiment of method of manufacturing asemiconductor integrated circuit device according to the invention.

[0117]FIG. 2 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0118]FIG. 3 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0119]FIG. 4 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0120]FIG. 5 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0121]FIG. 6 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0122]FIG. 7 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0123]FIG. 8 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0124]FIG. 9 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0125]FIG. 10 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0126]FIG. 11 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0127]FIG. 12 is a graph illustrating the relationship between thediameter of each of the contact holes formed in three different siliconoxide type insulating films and the ratio of the rate of dry etchingeach of the insulating films to that of dry etching a silicon nitridefilm obtained as a result of an experiment.

[0128]FIG. 13 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0129]FIG. 14 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0130]FIG. 15 is a graph illustrating the relationship between the rateof etching an SOG film wet-cleaned with a cleaning solution containinghydrofluoric acid and the heat treatment temperature for forming the SOGfilm.

[0131]FIG. 16 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0132]FIG. 17 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0133]FIG. 18 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0134]FIG. 19 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0135]FIG. 20 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0136]FIG. 21 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0137]FIG. 22 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0138]FIG. 23 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0139]FIG. 24 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0140]FIG. 25 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0141]FIG. 26 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0142]FIG. 27 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0143]FIG. 28 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0144]FIG. 29 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0145]FIG. 30 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0146]FIG. 31 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0147]FIG. 32 is a schematic cross sectional view of a principal portionof a substrate, also illustrating the embodiment of method ofmanufacturing a semiconductor integrated circuit device according to theinvention.

[0148]FIG. 33 is a graph illustrating the relationship between thecontact angle and the diameter of the water drop made to fall onto thesurface of an SOG film (HSQ-SOG) made of hydrosilsesquioxan and thewavelength of the ultraviolet rays used to irradiate the surface of thefilm observed in an experiment.

[0149]FIG. 34 is a graph illustrating the relationship between thecontact angle and the diameter of the water drop made to fall on thesurface of an SOG film (HSQ-SOG) made of hydrosilsesquioxan and theduration of irradiation of ultraviolet rays to the surface of the filmobserved in an experiment.

[0150]FIG. 35 a schematic cross sectional view of a principal portion ofa substrate, also illustrating the embodiment of method of manufacturinga semiconductor integrated circuit device according to the invention.

[0151]FIG. 36 a schematic cross sectional view of a principal portion ofa substrate, also illustrating the embodiment of method of manufacturinga semiconductor integrated circuit device according to the invention.

[0152]FIG. 37 a schematic cross sectional view of a principal portion ofa substrate, also illustrating the embodiment of method of manufacturinga semiconductor integrated circuit device according to the invention.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS

[0153] Now, the present invention will be described in greater detail byreferring to the accompanying drawings that illustrate a preferredembodiment of the invention. Throughout the views of the drawing, thesame components are denoted respectively by the same reference symbolsand would not be described repeatedly.

[0154] The embodiment of method of manufacturing a semiconductorintegrated circuit device according to the invention is adapted tomanufacture a DRAM (Dynamic Range Access Memory). It will be describedbelow by referring to FIGS. 1 through 37 progressively. Not that, ineach view of the drawing illustrating a cross sectional view of thedevice, a region (memory cell array) where memory cells of the DRAM areformed is shown to the left and a peripheral circuit region is shown tothe right.

[0155] Firstly, referring to FIG. 1, an element isolating groove 2 isformed in a semiconductor substrate (to be referred to simply assubstrate hereinafter) made of p-type single crystal silicon showing aspecific resistance between about 1 and 10 Ωcm.

[0156] The element isolating groove 2 is produced by etching the elementisolating region of the substrate 1 to give rise to a groove having adepth of about 350 nm and subsequently forming a silicon oxide film 6that is as thin as 10 nm on the inner wall of the groove by thermallyoxidizing the substrate 1 at about 1,000° C. The silicon oxide film 6heals the damage done to the inner wall of the groove during the dryetching operation and reduce the stress that can be generated along theinterface of the SOG film 7 to be buried in the groove in the nextprocessing step and the substrate 1.

[0157] Then, a liquid substance (chemical solution) containinghydrosilsesquioxan as principal ingredient is applied onto the substrate1 including the inside of the groove by spin coating and, thereafter,baked at about 90° C. for a minute and subsequently at about 150° C. foranother minute. Then, the solvent of the substrate is gasified byheat-treating the applied substance at about 400° C. for 30 minutes (afirst heat treatment) in an inert gas atmosphere typically containingnitrogen. As a result, an SOG film is produced as the Si—H bonds thereofare oxidized by about 20 to 30% to produce Si—OH bonds according to theabove chemical formula (2).

[0158] Since the produced SOG film shows an excellent gap filling effectto a fine space if compared with a silicon oxide film deposited by CVD,it can satisfactorily fill the groove even when the latter has a largeaspect ratio.

[0159] Then, in this embodiment, said SOG film is subjected to a heattreatment (second heat treatment) conducted at high temperature above800° C. in an oxygen-containing atmosphere. For the purpose of thepresent invention, an oxygen-containing atmosphere refers not only to anatmosphere containing oxygen (O₂) but also to an atmosphere containingoxidizing gas such as NO or NO₂. As a result of this second heattreatment, the reaction of chemical formula (2) goes further and the OHradicals bonded to Si atoms react each other to release water (H₂O) andproduce an SOG film 7 having a molecular structure as expressed bychemical formula (3) below.

[0160] The obtained SOG film 7 does not contain any hydrogen (H) in themolecule except a trace of residual hydrogen and substantially comprisesonly Si—O—Si bonds to make the film very dense and highlymoisture-resistant.

[0161] Then, the SOG film 7 is chemically and mechanically polished inan area above the groove to planarize the surface and produce acompleted element isolating groove 2.

[0162] Thereafter, as shown in FIG. 2, ions of a p-type impuritysubstrate (boron) and those of an n-type impurity substance (e.g.,phosphor) are implanted into the substrate 1 and subsequently theimpurities are made to diffuse in a heat treatment process conducted atabout 1,000° C. in order to produce a p-type well 3 and an n-type well 5in the memory cell array and also a p-type well 3 and an n-type well 4in the peripheral circuit region.

[0163] Then, the surface of the substrate 1 (the p-type well 3 and then-type well 4) is wet-cleaned by means of a cleaning solution containinghydrofluoric acid and subsequently an about 6 nm thick clean gate oxidefilm 8 is formed on the surface of the p-type well 3 and that of then-type well 4 by means of a thermal oxidation process conducted at about800° C. The gate oxide film 8 may partly comprise a silicon oxidenitride film containing silicon oxide. A silicon oxide nitride film caneffectively suppress any generation of a high interface energy level andreduce electron traps when compared with a silicon oxide film so that itcan improve the resistance against hot carriers of the gate oxide film8. A silicon oxide nitride film can typically be formed by thermallyoxidizing the substrate 1 in an atmosphere containing nitrogen gas thatmay be NO and/or NO₂.

[0164] Then, as shown in FIG. 3, an about 100 nm thick low resistancepolycrystalline silicon film 9 a doped with phosphor (P) is deposited onthe gate oxide film 8 by CVD and subsequently an about 5 nm thick WNfilm 9 b and an about 50 nm thick W film 9 c are sequentially depositedthereon by sputtering. Then, an about 100 nm thick silicon oxide film 10a is further deposited thereon by CVD.

[0165] Thereafter, the film layers are subjected to a heat treatmentprocess conducted at about 800° C. in an inert gas atmosphere typicallycontaining nitrogen in order to reduce the stress of said W film 9 c anddensify the WN film 9 b. Note that the silicon oxide film 10 a on the Wfilm 9 c is formed to reduce the stress along the interface of thesilicon nitride film (10 b) to be deposited on the silicon oxide film 10a in the next step and the underlying W film 9 c.

[0166] Then, as shown in FIG. 4, an about 100 nm thick silicon nitridefilm lob is deposited on the silicon oxide film 10 a by CVD andsubsequently the formed silicon nitride film 10 b is etched out bydry-etching, using a photoresist film (not shown) as mask, except theareas where gate electrodes are to be formed.

[0167] After removing the photoresist film, gate electrodes 9, eachcomprising a polycrystalline silicon film 9 a, an WN film 9 b, a W film9 c, are formed both in the memory cell array and in the peripheralcircuit region as shown in FIG. 5 by dry-etching the silicon oxide film10 a, the W film 9 c, the WN film 9 b and the polycrystalline siliconfilm 9 a, using the silicon nitride film 10 b as mask and then a capinsulating film 10 comprising a silicon oxide film 10 a and a siliconnitride film 10 b is formed on the gate electrode 9. Note that the gateelectrodes 9 formed in the memory cell array operate as word lines WL.

[0168] Thereafter, as shown in FIG. 6, ions of an n-type impuritysubstance (phosphor or arsenic) are implanted into the p-type well 3 atthe opposite lateral sides of the gate electrodes 9 to produce n-typesemiconductor regions 11 and then ions of a p-type impurity substance(boron) are implanted into the n-type well 4 to produce p-typesemiconductor regions 12.

[0169] Then, as shown in FIG. 7, an about 50 nm thick silicon nitridefilm 13 is deposited on the substrate 1 by CVD and subsequently sidewall spacers 13 a are formed on the lateral walls of the gate electrodes9 in the peripheral circuit region by covering the top of the memorycell array with photoresist (not shown) and anisotropically etching thesilicon nitride film 13 in the peripheral circuit region. Then, n+-typesemiconductor regions (source/drain regions) 14 are formed by implantingions of an n-type impurity substance (phosphor or arsenic) in the p-typewell 3 of the peripheral circuit region and p+-type semiconductorregions (source/drain regions) are formed by implanting ions of a p-typeimpurity substance (boron) in the n-type well 4 of the peripheralcircuit region. Thus, an n-channel type MISFET Qn and a p-channel typeMISFET Qp comprising source/drain regions having an LDD (Lightly DopedDrain) structure are prepared by the above steps.

[0170] Then, as shown in FIG. 8, an SOG film 16 is formed above the gateelectrodes 9. More specifically, the SOG film 16 is formed firstly byapplying a liquid substance (chemical solution) containinghydrosilsesquioxan as principal ingredient onto the substrate 1 by spincoating. As seen from the chemical formula (2), hydrosilsesquioxan has amolecular structure where oxygen atoms (O) and hydrogen atoms (H) arebonded to a silicon (Si) atom and hence does not contain any nitrogen inthe molecule. The molecular weight (n) of hydrosilsesquioxan is betweenseveral hundreds and ten thousands and, typically equal to about 2,000.Hydrosilsesquioxan shows a relative dielectric constant approximatelybetween 2.7 and 2.9.

[0171] Then, the applied substance is baked at about 90° C. for a minuteand then at about 150° C. also for another minute and subsequently thesolvent of the solution is gasified by heating it at about 400° C. for30 minutes (first heat treatment). As a result, a chemical reaction asexpressed by formula (2) takes place to oxidize the Si—H bonds by 20 to30% and produce an SOG film having Si—OH bonds. The obtained SOG filmshows a relative dielectric constant approximately between 3.2 and 3.4.

[0172] Since the produced SOG film shows an excellent gap filling effectto a fine space if compared with a silicon oxide film deposited by CVDor a BPSG film, it can satisfactorily fill the minute space separatingadjacently located gate electrodes 9 (word lines WL).

[0173] Then, said SOG film is subjected to a heat treatment (second heattreatment) at about 800° C. for about 5 to 10 minutes in anoxygen-containing atmosphere. As a result, the reaction as expressed bychemical formula (2) proceeds further to encourage the OH radicalsbonded to Si atoms to react with each other to release water (H₂O) andproduce an SOG film 7 having a molecular structure as expressed bychemical formula (3). Note that the obtained SOG film 16 shows arelative dielectric constant approximately between 3.8 and 4.0.

[0174] The obtained SOG film 16 does not contain any hydrogen (H) in themolecule except a trace of residual hydrogen and substantially comprisesonly Si—O—Si bonds to make the film very dense and highlymoisture-resistant.

[0175] As pointed out above, an SOG film 16 having a structure asexpressed by chemical formula (3) is obtained only by heat-treating anSOG film that has been subjected to a heat treatment at about 400° C.again at high temperature not lower than 600° C. in an oxygen-containingatmosphere. For the purpose of the present invention, anoxygen-containing atmosphere refers not only to an atmosphere containingoxygen (O₂) but also to an atmosphere containing oxidizing gas such asNO or NO₂.

[0176] During the above high temperature heat treatment, the steam (H₂O)concentration in the atmosphere is preferably as low as possible.Additionally, the high temperature heat treatment should be conductedafter a baking process for gasifying and dispelling the solvent becausethe latter can be fiercely gasified from the chemical solution togenerate bubbles in the film if the chemical solution ofhydrosilsesquioxan applied to the substrate 1 by spin coating isdirectly heated to high temperature.

[0177] As will be discussed hereinafter, in the process of manufacturinga DRAM, the capacitive insulating film of a capacitive element may becrystallized, fed with oxygen and/or subjected a high temperature heattreatment. If such is the case, the high temperature heat treatment forobtaining a dense SOG film 16 should be conducted at temperature higherthan the heat treatment temperature to be conducted in the step offorming the capacitive insulating film. If the high temperature heattreatment for obtaining a dense SOG film 16 is conducted at temperaturelower than the heat treatment of the step of forming the capacitiveinsulating film, gas containing residual hydrogen can be released fromthe inside of the SOG film 16 during the step of forming the capacitiveinsulating film to degrade the quality of the SOG film 16. However, onthe other hand, if the temperature of the heat treatment for producing adensified SOG film 16 is too high, the impurities introduced in thesemiconductor regions of the MISFET can be diffused, if partly, into thesubstrate 1 to make it impossible to realize a shallow pn junction to byturn give rise to adverse effects including a degraded mutualconductance (Gm) of the MISFET and a fluctuating threshold voltage.Therefore, the heat treatment for producing a densified SOG film 16 ispreferably conducted at temperature slightly higher than the temperatureof the heat treatment of the step of forming the capacitive insulatingfilm.

[0178] Then, as shown in FIG. 9, the surface of the SOG film 16 isplanarized by chemical and mechanical polishing. Since an SOG filmprepared by way of a heat treatment at about 400° C. is soft relative toa silicon oxide film deposited by means of a CVD technique, it isnormally difficult to use CMP to such a film. However, on the otherhand, an SOG film 16 heat-treated at high temperature of about 800° C.is as dense as a silicon oxide film deposited by CVD and hence can besubjected to a CMP process. Then, the top of the gate electrodes 9 canbe planarized by using a single SOG film 16 to reduce the number ofsteps necessary for manufacturing a semiconductor integrated circuitdevice.

[0179] Then, as shown in FIG. 10, the SOG film 16 of the memory cellarray is etched out by dry etching, using a photoresist film (not shown)as mask. Then, as shown in FIG. 11, contact holes 18, 19 are produced inan upper portion of the n-type semiconductor region 11 by dry etchingthe silicon nitride film 13 underlying the SOG film 16.

[0180] The above operation of etching the SOG film 16 is conducted undera condition that makes the rate of etching silicon oxide (SOG film 16)higher than that of etching silicon nitride so that the silicon nitridefilm 13 may not be completely removed. Additionally, the operation ofetching the silicon nitride film 13 is conducted under a condition thatmakes the rate of etching silicon nitride higher than that of etchingsilicon (substrate) and silicon oxide so that neither the substrate 1nor the SOG film 7 may be scraped off deeply. Still additionally, theoperation of etching the silicon nitride film 13 is conducted under acondition that allows the silicon nitride film to be etchedanisotropically and hence it may be left on the lateral walls of thegate electrodes 8 (word lines WL). Thereby, contact holes 18 and 19having a small diameter are formed by self alignment against the gateelectrodes 9 (word lines WL).

[0181]FIG. 12 is a graph illustrating the relationship between thediameter of each of the contact holes formed in three different siliconoxide type insulating films and the ratio of the rate of dry etchingeach of the insulating films to that of dry etching a silicon nitridefilm obtained as a result of an experiment. In FIG. 12, HSQ-SOG denotesan SOG 16 obtained as a result of a heat treatment conducted at hightemperature of about 800° C. in an oxygen-containing atmosphere andnitrogen-containing SOG denotes an SOG film obtained from polysilazan,whereas PE-CVD denotes a silicon oxide film deposited by plasma CVD. Theratio of the rate of etching a silicon oxide film relative to that ofetching a silicon nitride film is expressed by 1 when a contact hole isformed to a diameter of 1 μm in a silicon oxide film (PE-CVD) depositedby plasma CVD.

[0182] As seen from FIG. 12, the SOG film (nitrogen-containing SOG)obtained from polysilazan shows a rapid fall in the ratio of the etchingrate relative to that of etching a silicon nitride film to make it verydifficult to produce a contact hole when the diameter of the contacthole is reduced because of the nitrogen contained in the molecule.Contrary to this, an SOG film (16) of this embodiment shows a ratiohigher than the silicon oxide film (PE-CVD) deposited by plasma CVD sothat a contact hole having a diameter less than 0.25 μm can be realized.An SOG film 16 obtained from hydrosilsesquioxan shows a large ratio ofthe etching rate relative to that of etching a silicon nitride becauseit does not contain any nitrogen.

[0183] Then, as shown in FIG. 13, ions of an n-type impurity substance(phosphor or arsenic) are implanted into the p-type well 3 (n-typesemiconductor region 11) by way of the contact holes 18, 19 to producen+-type semiconductor regions 17 (source/drain regions). An n-typememory selection MISFET Qs is prepared in the memory cell array by theabove steps.

[0184] Then, as shown in FIG. 14, plugs 20 are formed in the contactholes 18, 19. More specifically, plugs 20 are formed by wet-cleaning theinside of the contact holes 18, 19 by means of a fluorine-containingcleaning solution, subsequently depositing a low resistancepolycrystalline silicon film doped with an n-type impurity substancesuch as phosphor (P) on the SOG film 16 including the contact holes andthen etching back the polycrystalline silicon film (by means of CMP)except the inside of the contact holes 18, 19.

[0185]FIG. 15 is a graph illustrating the relationship between the rateof etching an SOG film after wet-cleaning the SOG film with a cleaningsolution containing hydrofluoric acid by 0.5% and the heat treatmenttemperature required for producing the SOG film. As seen from FIG. 15,an SOG film simply subjected to a heat treatment at about 400° C.(baking process) shows a contact hole having its diameter remarkablyincreased as a result of wet-cleaning the inside thereof because itprovides a very high etching rate so that the plugs formed in adjacentcontact holes can become electrically leaky and/or short-circuited.

[0186] On the other hand, an SOG film subjected to a high temperatureheat treatment at about 800° C. shows a contact hole having its diameterincreased only slightly because of a relatively low etching rate. Thus,when an SOG film of hydrosilsesquioxan is formed on the gate electrodes9 and heat treated at high temperature of about 800° C. to densify it,the plugs 20 formed in adjacent contact holes 18, 19 are successfullyprevented from becoming electrically leaky and/or short-circuited.

[0187] Then, as shown in FIG. 16, an about 20 nm thick silicon oxidefilm 21 is deposited on the SOG film 16 by means of CVD and subsequentlythe silicon oxide film 21 and the underlying SOG film 16 is dry-etchedfrom the peripheral circuit region by using a photoresist film (notshown) as mask to produce contact holes 22 on the source/drain (n+-typesemiconductor region 14) of the n-channel type MISFET Qn and alsocontact holes 23 on the source/drain (p+-type semiconductor region 15)of the p-channel type MISFET Qp. At the same time, a contact hole 24 isformed on the gate electrode 9 of the p-channel type MISFET Qp in theperipheral circuit region (and also on the gate electrode 9 of then-channel type MISFET Qp in a region not shown). A through hole is alsoformed above the contact hole 18 in the memory cell array.

[0188] Then, as shown in FIG. 17, a silicide film is formed on thesurface of the source/drain (n+-type semiconductor region 14) of then-channel type MISFET Qn, that of the source/drain (n+-typesemiconductor region 15) of the p-channel type MISFET Qp and that of theplugs 20 in the contact holes 18 and subsequently plugs 27 are formed inthe respective contact holes 22, 23, 24.

[0189] More specifically, the above silicide film 26 is formed typicallyby depositing an about 30 nm thick Ti film and an about 20 nm thick TiNfilm on the silicon oxide film 21 including the inside of the contactholes 22, 23, 24 and also the inside of the through hole 25 bysputtering and then heat-treating the substrate 1 at about 650° C. Theplug 27 is formed by depositing an about 50 nm thick TiN film and anabout 300 nm thick W film on the above TiN film including the inside ofthe contact holes 22, 23, 24 and also the inside of the through hole 25by CVD and then polishing the W film, the TiN film and the Ti film onthe silicon oxide film 21 until the films are completely removed exceptthe inside of the contact holes 22, 23, 24 and the through hold 25.

[0190] The operation speed of the MISFETs (n-channel type MISFET Qn,p-channel type MISFET Qp) of the peripheral circuit is improved as thecontact resistance of the source/drain regions (n+-type semiconductorregion 14, p+-type semiconductor region 15) and the plug 27 is reducedby forming the silicide film 26, which is a Ti silicide film, along theinterface of the source/drain regions (n+-type semiconductor region 14,p+-type semiconductor region 15) and the plug 27 formed thereon.

[0191] Then, as shown in FIG. 18, a bit line BL is formed on the siliconoxide film 21 of the memory cell array and first layer wires 30 through33 are formed on the silicon oxide film 21 on the peripheral circuitregion. More specifically, the bit line BL and the first layer wires 30through 33 are formed typically by depositing an about 100 nm thick Wfilm on the silicon oxide film 21 by sputtering and dry etching the Wfilm, using a photoresist film as mask. Since the SOG film 16 underlyingthe bit line BL and the wires 30 through 33 is planarized, they can bepatterned with an enhanced level of precision.

[0192] Thereafter, as shown in FIG. 19, an about 300 nm thick SOG film34 is formed on the bit line BL and the first layer wires 30 through 33by means of the technique described above by referring to the SOG film16. More specifically, a liquid substance (chemical solution) containinghydrosilsesquioxan as principal ingredient is applied to the substrate 1now carrying the bit line BL and the first layer wires 30 through 33 byspin coating and baked at about 90° C. for a minute and then at about150° C. for another minute. Then, the solvent is gasified and dispelledby heat-treating the substance at about 800° C. for about 5 to 10minutes in an oxygen-containing atmosphere to produce a dense SOG film34 having a molecular structure as expressed by chemical formula (3).For the reasons as described earlier, the high temperature heattreatment process for producing a dense SOG film 34 is conducted attemperature slightly higher than the subsequent heat treatment processfor producing a capacitive insulating film.

[0193] If the surface of the SOG film 34 shows undulations due to thepresence of the bit line BL and the wires 30 through 33, it isplanarized by chemical and mechanical polishing.

[0194] Then, as shown in FIG. 20, an about 200 nm thick polycrystallinesilicon film 35 is deposited on the SOG film 34 by CVD and then dryetched from the memory cell array by using a photoresist film as mask toproduce grooves 36 in the polycrystalling silicon film 35 that arelocated above the respective contact holes 19.

[0195] Then, as shown in FIG. 21, side wall spacers 37 are formed alongthe lateral walls of the grooves 36 and subsequently the SOG film 34 andthe underlying silicon oxide film 21 are dry etched by using the sidewall spacers 37 and the polycrystalline silicon film 35 as mask toproduce through holes 38 above the respective contact holes 19. Notethat the side wall spacers 37 along the lateral walls of the grooves 36are formed by depositing a polycrystalline silicon film on thepolycrystalline silicon film 35 including the inside of the grooves 36by means of CVD and then anisotropically etching the polycrystllinesilicon film until it is left only along the lateral walls of thegrooves 36.

[0196] As the through holes 38 are formed from the bottoms of thegrooves 36 having the side wall spacers 37 formed along their lateralwalls, the diameter of the through holes 38 are made smaller than thatof the contact holes 19 located thereunder. As a result, a reliablealignment margin is provided when aligning the bit line BL and thethrough hole 38 if the size of the memory cell array is reduced so thatany possible short-circuiting of the plugs 39 that are buried in therespective through holes 38 in the next step and the bit line BL will bereliably eliminated.

[0197] Then, after dry etching the polycrystalline silicon film 35 andthe side wall spacers 37 to remove them, plugs 39 are formed in therespective through holes 38 as shown in FIG. 22. More specifically, theplugs 39 are formed by depositing a low-resistance polycrystallinesilicon film doped with an n-type impurity substance (phosphor) on theSOG film 34 including the through holes 38 by CVD and then etching backthe polycrystalline silicon film until it is left only in the inside ofthe through holes 38.

[0198] Thereafter, as shown in FIG. 23, an about 100 nm thick siliconnitride film 40 is deposited on the SOG film 34 by CVD and subsequentlya silicon oxide film 41 is deposited above the silicon nitride film 40also by CVD. Then, the silicon oxide film 41 is dry etched from thememory cell array by using a photoresist film (not shown) as mask andsubsequently the silicon nitride film 40 underlying the silicon oxidefilm is also dry etched to produce grooves 42 above the respectivethrough holes 38. Since the lower electrodes of the capacitive elementsfor storing information are formed along the inner walls of the grooves42, a relatively thick (e.g., about 1.3 μm thick) oxide film 41 has tobe deposited to produce the grooves 42 when the lower electrodes arerequired to have a large surface area in order to increase the electriccharge to be stored there.

[0199] Then, as shown in FIG. 25, an about 50 nm thick amorphous siliconfilm 43 a doped with an n-type impurity substance (phosphor) isdeposited on the silicon oxide film 41 including the inside of thegrooves 42 by CVD and subsequently it is etched back from the top of thesilicon oxide film 41 to make the amorphous silicon film 43 a left onlyon the inner walls of the grooves 42.

[0200] Then, as shown in FIG. 26, the surface of the amorphous siliconfilm 43 a left in the grooves 42 are wet-cleaned with a cleaningsolution containing hydrofluoric acid, and monosilane (SiH₄) is suppliedto the surface of the amorphous silicon film 43 a in a low pressureatmosphere. Subsequently, the substrate 1 is heat-treated to turn theamorphous silicon film 43 a into polycrystalline silicon film and, atthe same time, grow silicon particles on the surface. As a result, apolycrystalline silicon film 43 is formed with a coarsened surface onthe inner walls of the grooves 42. The polycrystalline silicon film 43is used for the lower electrodes of the capacitive elements for storinginformation.

[0201] Then, as shown in FIG. 27, an about 15 nm thick tantalum oxide(Ta₂O₅) film 44 is deposited on the silicon oxide film 41 including theinside of the grooves 42 by CVD and subsequently heat-treated at about800° C. for 3 minutes in an oxygen-containing atmosphere to crystallizethe tantalum oxide film 44 and, at the same time, repair the defects, ifany, thereof by means of oxygen fed to it. The tantalum oxide film 44 isused as capacitive insulating film for the capacitive elements forstoring information.

[0202] As described above, the high temperature heat treatment fordensifying the SOG film 16 and that of densifying the SOG film 34 areconducted at temperature higher than the heat treatment forcrystallizing the tantalum oxide film 44. Therefore, the film quality ofthe SOG film 16 and that of the SOG film 34 would not be degraded by thehigh temperature heat treatment of the tantalum oxide film 44.

[0203] Then, as shown in FIG. 28, an about 150 nm thick TiN film 45 isdeposited on the tantalum oxide film 44 including the inside of thegroove 42 by means of a combined used of CVD and sputtering andsubsequently the TiN film 45 and the tantalum oxide film 44 are dryetched by using a photoresist film (not shown) as mask to producecapacitive elements C for storing information, each comprising an upperelectrode made of the TiN film 45, a capacitive insulating made of thetantalum oxide film 44 and a lower electrode made of the polycrystallingsilicon film 43. Thus, the memory cells of the DRAM including memorycell selecting MISFETs Qs and information storage capacitive elements Cconnected in series to the MISFETs Qs are completed by the above steps.

[0204] The capacitive insulating film of the information storagecapacitive elements C should not necessarily be made of a tantalum oxidefilm 44 and may alternatively be made of a film containing a highdielectric or ferroelectric substance having a perovskite or complexperovskite crystal structure such as PZT, PLT, PLZT, PbTiO₃, SrTiO₃,BaTiO₃, BST, SBT or Ta₂O₅ as principal ingredient.

[0205] Then, two aluminum (Al) wiring layers are formed on theinformation storage capacitive elements C in a manner as describedbelow.

[0206] Firstly, as shown in FIG. 29, an about 100 nm thick silicon oxidefilm 50 is deposited on the information storage capacitive elements C byCVD. At this time, since a rather thick silicon oxide film 41 is left inthe peripheral circuit region, the height (level) of the surface of thesilicon oxide film 50 from the surface of the substrate 1 issubstantially same in the memory cell array and in the peripheralcircuit region.

[0207] Then, as shown in FIG. 30, through holes 51, 52 are formed by dryetching the silicon oxide films 50, 41, the silicon nitride film 40 andthe SOG film 34 above the first wiring layers 30, 33 in the peripheralcircuit region by using a photoresist film (not sown) as mask.Subsequently, plugs 53 are formed in the through holes 51, 52respectively by depositing an about 100 nm thick TiN film on the siliconoxide film 50 typically by means of sputtering and an about 500 nm thickW film thereon by means of CVD and subsequently etching back the filmsuntil they are left only in the through holes 51, 52.

[0208] Then, as shown in FIG. 31, wires 54 through 56 of the secondwiring layer are formed on the silicon oxide film 50. More specifically,the wires 54 through 56 are formed by sequentially depositing an about50 nm thick TiN film, an about 500 nm thick aluminum (Al) alloy film andthen another about 50 nm thick TiN film by sputtering on the siliconoxide film 50 and are then dry etching the films by using a photoresistfilm (not shown). Since the surface of the silicon oxide film 50underlying the wires 54 through 56 in the memory cell array is flushwith that of the silicon oxide film 50 in the peripheral circuit region,the wires 54 through 56 can be patterned with an enhanced precisionlevel.

[0209] Thereafter, as shown in FIG. 32, an SOG film 57 is formed on thesecond layer wires 54 through 56. More specifically, the SOG film 57 isformed by applying a liquid substance (chemical solution) containinghydrosilsesquioxan as principal ingredient on the substrate 1 by spincoating, baking the substance at 90° C. for a minute and then at 150° C.for another minute and subsequently heat-treating it at about 400° C.for 30 minutes in an atmosphere of inert gas such as nitrogen to gasifythe substance.

[0210] As described above, in the case of this embodiment of theinvention, while the SOG films (16, 34) formed below the informationstorage capacitive elements C are densified by heat-treating them athigh temperature of about 800° C., the SOG film 57 formed on theinformation storage capacitive elements C is not subjected to any heattreatment.

[0211] The relative dielectric constant of the SOG film 57 formed byheat treating hydrosilsesquioxan at about 400° C. is approximatelybetween 3.2 and 3.4, which is lower than the relative dielectricconstant (about 3.8 to 4.0) of the SOG films (16, 4) densified by meansof a high temperature heat treatment. Thus, the inter-wire capacitanceof the DRAM can be reduced to improve the operating speed of the DRAM byarranging an SOG film 57 having a low dielectric constant as insulatingfilm between the wires 54 through 56 of the second wiring layer and thewires of the third wiring layer formed thereon in a subsequent step.

[0212] Note that the interlayer insulating film arranged between thewires 54 through 56 of the second wiring layer and the third wiringlayer may be made to have a three-layered structure (silicon oxidefilm/SOG film/silicon oxide film) by depositing silicon oxide filmsrespectively on and under the low dielectric constant SOG film 57 bymeans of plasma CVD. Alternatively, if the inter-wire capacitance is nota serious problem, the low dielectric constant SOG film 57 may bereplaced by a polysilazan type SOG film (with a relative dielectricconstant of about 4.0 to 5.0). However, in any case, the heat treatmentof the SOG film has to be conducted at temperature not by far higherthan 400° C. in order to prevent the wires 54 through 56 mainly made ofan aluminum (Al) film and the capacitive elements made of a tantalumoxide film 44 from being degraded by heat.

[0213] When the relatively thick insulating film formed between thewires 54 through 56 of the second wiring layer and the wires of thethird wiring layer solely consists of an SOG film 57, it may bedifficult to obtain the film thickness (800 to 1,000 nm) required for aninterlayer insulating film simply by applying a chemical solution ofhydrosilsesquioxan in a single process. If, on the other hand, achemical solution of hydrosilsesquioxan is applied onto the existing SOGfilm 57 in order to raise the thickness of the SOG film, the surface ofthe existing SOG film would strongly repels the applied chemicalsolution because the surface of the SOG film 57 made ofhydrosilsesquioxan is full of Si—H bonds.

[0214] However, when applying hydrosilsesquioxan onto an SOG film ofhydrosilsesquioxan to raise the thickness of the film, this problem canbe bypassed by heat treating the film at about 400° C. to harden it andsubsequently irradiating the surface of the film with ultraviolet raysin an oxygen-containing atmosphere to modify the surface of the filmbefore applying the chemical solution of hydrosilsesquioxan thereto.With this arrangement, a relatively thick SOG film 57 can be formed witha uniform film thickness that can not be achieved by a single spincoating so that the space separating the wires 54 through 56 can befilled with the SOG film 57 without losing the planar surface of thefilm.

[0215]FIG. 33 is a graph showing the relationship between the contactangle and the diameter of the water drop made to fall on the surface ofan SOG film (HSQ-SOG) made of hydrosilsesquioxan and the wavelength ofthe ultraviolet rays used to irradiate the surface of the film observedin an experiment. FIG. 34 is a graph showing the relationship betweenthe contact angle and the diameter of the water drop made to fall on thesurface of an SOG film (HSQ-SOG) made of hydrosilsesquioxan and theduration of irradiation of ultraviolet rays (wavelength=172 nm) to thesurface of the film observed in an experiment.

[0216] As shown in FIG. 33, the contact angle of the water drop isreduced and its diameter of the water drop is increased when thewavelength of the irradiated ultraviolet rays falls below 200 nm.Meanwhile, as shown in FIG. 34, the contact angle of the water drop isreduced and its diameter is increased when the duration of irradiationexceeds about 30 seconds. From these findings, it will be same to saythat the wetting propensity of the chemical solution is remarkablyimproved when the surface of the SOG film is irradiated with ultravioletrays having a wavelength less than 200 nm for more than 30 seconds.

[0217] Then, as shown in FIG. 35, a through hole 58 is formed above theinformation storage capacitive elements C by dry etching the SOG film 57of the memory cell array and the underlying silicon oxide film 50 byusing a photoresist film (not shown) as mask. Additionally, anotherthrough hole 59 is formed above the wire 56 by dry etching the SOG film57 of the peripheral circuit region.

[0218] Then, plugs are formed respectively in said through holes 58, 59.However, before forming the plugs, side wall spacers 60 are formed onthe inner walls of the through holes 58, 59 as shown in FIG. 36 prior toforming the through holes 58, 59 with this embodiment.

[0219] When through holes 58, 59 are formed by etching the SOG film 57made of hydrosilsesquioxan, gas containing residual hydrogen can bereleased into the through holes 58, 59 from the inside of the film thatis rich with Si—H bonds to consequently raise the electric resistance ofthe plugs. Therefore, with this embodiment, side wall spacers 60 areformed on the inner walls of the through holes 58, 59 to prevent gasfrom being discharged into the through holes 58, 59 and consequentlyprevent the plugs from raising their electric resistance.

[0220] The side wall spacers 60 are preferably made of a dense filmshowing a high gas barrier effect. For example, they may be made bydepositing a silicon oxide film or a silicon nitride film on the SOGfilm 57 including the inside of the through holes 58, 59 by plasma CVDand subsequently anisotropically etching the film until it is completelyremoved except the inner walls of the through holes 58, 59.

[0221] Then, as shown in FIG. 37, after forming plugs 61 respectively inthe through holes 58, 59, wires 62, 63 of the third wiring layer areprepared on the SOG film 57. More specifically, the plugs 61 are formedby depositing a W film (or a TiN film and a W film) on the SOG film 57including the inside of the through holes 58, 59 by CVD and subsequentlyetching back the film on the SOG film 57 until it is completely removedexcept the inside of the through holes 58, 59. Then, the wires 62, 63are formed by sequentially depositing an about 50 nm thick TiN film, anabout 500 nm thick Al film and an about 50 nm thick Ti film on the SOGfilm 57 by sputtering and subsequently dry etching these films by usingphotoresist (not shown) as mask.

[0222] Thereafter, a passivation film comprising a silicon oxide filmand a silicon nitride film is deposited on the wires 62, 62 of the thirdwiring layer, although not shown in the accompanying drawing. With theabove described steps, a DRAM according to the invention issubstantially completed.

[0223] While the present invention is described in detail by way of anembodiment, the present invention is by no means limited to theembodiment, which may be modified or altered in various different wayswithout departing from the scope of the invention.

[0224] While the embodiment is applied to a DRAM in the abovedescription, the present invention is by no means limited thereto andcan find various applications when forming an insulating film for an LSIthat is to be manufactured with a design rule adapted to dimensions notexceeding 0.25 μm.

[0225] Thus, briefly the present invention provides the followingadvantages.

[0226] (1) According to the invention, it is now possible to form adense SOG film that does not contain any nitrogen so that a self aligncontact can be realized with ease to a great encouragement ofmanufacturing semiconductor integrated circuit devices withmciro-dimensions.

[0227] (2) According to the invention, it is now possible to apply a CMPtechnique to an SOG film so that the time required for the process offorming an insulating film can be significantly reduced.

[0228] (3) According to the invention, the wiring delay of asemiconductor integrated circuit device can be reduced by using an SOGfilm having a low dielectric constant as interlayer insulating filmarranged among metal wiring multilayers.

[0229] (4) According to the invention, the cost of manufacturing asemiconductor integrated circuit device can be significantly reduced byusing a less expensive SOG film for an insulating film.

What is claimed is:
 1. A method of manufacturing a semiconductorintegrated circuit device, comprising the steps of: (a) forming asilicon nitride film on a principal surface of a semiconductor substrateand subsequently applying a liquid substance containing a polymer ofsilicon, oxygen and hydrogen as principal ingredient onto said siliconnitride film; (b) forming an insulating film by subjecting said liquidsubstance to a first heat treatment, thereby gasifying the solventthereof; and (c) forming a contact hole through said insulating film andsaid silicon nitride film by etching said insulating film with a highetching rate relative to that of said silicon nitride film, andsubsequently etching said silicon nitride film.
 2. A method ofmanufacturing a semiconductor integrated circuit device according toclaim 1, wherein said polymer is hydrosilsesquioxan.
 3. A method ofmanufacturing a semiconductor integrated circuit device according toclaim 1, wherein, after having been subjected to said first heattreatment, said insulating film is subjected to a second heat treatmentat a temperature higher than said first heat treatment, prior to saidstep of etching said insulating film.
 4. A method of manufacturing asemiconductor integrated circuit device, comprising the steps of: (a)forming a semiconductor region on a surface of a semiconductor substrateand subsequently applying a liquid substance containing a polymer ofsilicon, oxygen and hydrogen as principal ingredient onto saidsemiconductor region; (b) forming an insulating film by subjecting saidliquid substance to a first heat treatment, thereby gasifying solventthereof: (c) subjecting said insulating film to a second heat treatment,and subsequently forming a contact hole by dry etching said insulatingfilm; and (d) forming a conductor layer electrically connected to saidsemiconductor region in said contact hole.
 5. A method of manufacturinga semiconductor integrated circuit device according to claim 4, whereinthe temperature of said second heat treatment is higher than that ofsaid first heat treatment.